Methods for antenna switch modules

ABSTRACT

Methods for antenna switch modules are disclosed. In certain implementations, a method of making an antenna switch module is provided. The method includes providing a package substrate implemented to receive one or more electrical components, attaching a silicon on insulator (SOI) die to the package substrate, and providing an integrated filter. The SOI die includes a capacitor and a switch coupled to a plurality of radio frequency (RF) signal paths. The integrated filter filters an RF signal received on a first RF signal path of the plurality of RF signal paths, and includes the capacitor of the SOI die and an inductor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/570,077, filed Aug. 8, 2012 and titled “ANTENNA SWITCH MODULES ANDMETHODS OF MAKING THE SAME”, which claims the benefit of priority under35 U.S.C. §119(e) of U.S. Provisional Patent Application No. 61/522,065,filed Aug. 10, 2011 and titled “ANTENNA SWITCH MODULES AND METHODS OFMAKING THE SAME”, each of which are herein incorporated by reference intheir entireties.

BACKGROUND

1. Field

Embodiments of the invention relate to electronic systems, and inparticular, to radio frequency (RF) electronics.

2. Description of the Related Technology

An RF system can include an antenna for receiving and/or transmitting RFsignals. However, there can be several components in an RF system thatmay need to access to the antenna. For example, an RF system can includedifferent transmit or receive paths associated with different frequencybands, different communication standards and/or different power modes,and each path may need access to the antenna at certain instances oftime.

An antenna switch module can be used to electrically connect an antennato a particular transmit or receive path of the RF system, therebyallowing multiple components to access the antenna. The performance ofthe antenna switch module can be important, since the antenna switchmodule can introduce noise and/or insertion loss. Furthermore, theantenna switch module can impact the area of the RF system, therebyaffecting a form factor of a wireless device using the antenna switchmodule.

There is a need for an antenna switch module having a relatively smallarea. Furthermore, there is a need for an antenna switch module that hasa relatively low insertion loss, improved harmonic performance, and arelatively high degree of isolation.

SUMMARY

In certain embodiments, the present disclosure relates to an antennaswitch module including a package substrate implemented to receive oneor more electrical components, a silicon on insulator (SOI) die, and afirst integrated filter. The SOI die includes a first capacitor and aswitch configured to be coupled to a plurality of radio frequency (RF)signal paths. The SOI die is attached to the package substrate. Thefirst integrated filter is configured to filter an RF signal received ona first RF signal path of the plurality of RF signal paths, and thefirst integrated filter includes the first capacitor of the SOI die anda first inductor.

In several embodiments, the package substrate includes a plurality ofconductive layers and a plurality of non conductive layers. According tocertain embodiments, the first inductor is formed at least partly from afirst conductive layer of the plurality of conductive layers, the firstconductive layer disposed beneath a layer of the package substrate usedto attach the SOI die. In a number of embodiments, the first inductor isa spiral inductor formed from trace of the first conductive layer.According to some embodiments, the first inductor is formed from traceof more than one of the plurality of conductive layers.

In several embodiments, the first inductor has an inductance rangingbetween about 2.5 nH and about 7 nH. According to some embodiments, thefirst capacitor has a capacitance ranging between about 0.8 pF and about2.7 pF.

In certain embodiments, the first inductor is a surface mount componentattached to the package substrate adjacent the SOI die.

In a number of embodiments, the antenna switch module further includes asecond integrated filter configured to filter a RF signal received on asecond RF signal path of the plurality of RF signal paths. The secondintegrated filter including a second capacitor of the SOI die and asecond inductor. In certain embodiments, the package substrate includesa plurality of conductive layers and a plurality of non conductivelayers, and the first and second inductors are formed at least partlyfrom a first conductive layer of the plurality of conductive layers, thefirst conductive layer disposed beneath a layer of the package substrateused to attach the SOI die. In a number of embodiments, the first andsecond inductors are separated by a column of vias in the packagesubstrate. In some other embodiments, the first inductor includes asurface mount inductor attached to the package substrate adjacent theSOI die and the second inductor is formed at least partly from a firstconductive layer of a plurality of conductive layers of the packagesubstrate, the first conductive layer disposed beneath a layer of thepackage substrate used to attach the SOI die. In certain otherembodiments, the first and second inductors include first and secondsurface mount inductors, respectively, the first and second surfacemount inductors attached to the package substrate.

In various embodiments, the SOI die is electrically connected to thepackage substrate using bond wires.

In accordance with a number of embodiments, the SOI die is a flip-chipdie that is electrically connected to the package substrate using solderbumps.

In several embodiments, the first inductor and first capacitor areelectrically connected in series.

In some embodiments, the switch is a single pole multi-throw switch.

In certain embodiments, the present disclosure relates to a packagesubstrate implemented to receive one or more electrical components, aSOI die including a capacitor and a switch configured to be coupled to aplurality of radio frequency (RF) signal paths, and a means forfiltering an RF signal received on a first RF signal path of theplurality of RF signal paths. The SOI die is attached to the packagesubstrate. The filtering means includes the capacitor of the SOI die andan inductor associated with the package substrate.

In several embodiments, the package substrate includes a plurality ofconductive layers and a plurality of non conductive layers. In a numberof embodiments, the inductor is formed at least partly from a firstconductive layer of the plurality of conductive layers, the firstconductive layer disposed beneath a layer of the package substrate usedto attach the SOI die.

In some embodiments, the inductor is a surface mount component attachedto the package substrate adjacent the SOI die.

In certain embodiments, the present disclosure relates to a method ofmaking an antenna switch module. The method includes providing a packagesubstrate implemented to receive one or more electrical components,attaching a SOI die to the package substrate, and providing anintegrated filter. The SOI die includes a capacitor and a switchconfigured to be coupled to a plurality of radio frequency (RF) signalpaths. The integrated filter is configured to filter an RF signalreceived on a first RF signal path of the plurality of RF signal paths.The integrated filter includes the capacitor of the SOI die and aninductor.

In a number of embodiments, the method further includes forming theinductor at least partly from a first conductive layer of a plurality ofconductive layers of the package substrate, the first conductive layerdisposed beneath a layer of the package substrate used to attach the SOIdie.

In various embodiments, the inductor is a surface mount component, andthe method further includes attaching the inductor to the packagesubstrate adjacent the SOI die.

In certain embodiments, the present disclosure relates to a wirelessdevice including an antenna switch module. The antenna switch moduleincludes a package substrate, a SOI die, and an integrated filter. TheSOI die includes a capacitor and a switch electrically connected to aplurality of radio frequency (RF) signal paths. The SOI die is attachedto the package substrate. The integrated filter includes the capacitorof the SOI die and an inductor. The integrated filter is configured tofilter an RF signal received on a first RF signal path of the pluralityof RF signal paths.

In some embodiments, the package substrate includes a plurality ofconductive layers and a plurality of non conductive layers. In a numberof embodiments, the inductor is formed at least partly from a firstconductive layer of the plurality of conductive layers, the firstconductive layer disposed beneath a layer of the package substrate usedto attach the SOI die.

In various embodiments, the inductor is a surface mount componentattached to the package substrate adjacent the SOI die.

According to some embodiments, the wireless device further includes anantenna electrically connected to the antenna switch module.

In certain embodiments, the wireless device further includes atransceiver electrically connected to the antenna switch module.

In several embodiments, the wireless device further includes a Wi-Fimodule electrically connected to the antenna switch module.

In various embodiments, the wireless device further includes a mobiletelevision module electrically connected to the antenna switch module.

In some embodiments, the wireless device further includes a front endmodule electrically connected to the antenna switch module.

In certain embodiments, the wireless device further includes a poweramplifier module electrically connected to the antenna switch module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram of one example of a wireless devicethat can include one or more antenna switch modules.

FIG. 2 is a schematic block diagram of another example of a wirelessdevice that can include one or more antenna switch modules.

FIG. 3 is a schematic block diagram of one example of an antenna switchmodule.

FIG. 4A is a schematic top plan view of an antenna switch moduleaccording to one embodiment.

FIG. 4B is a cross section of the antenna switch module of FIG. 4A takenalong the lines 4B-4B.

FIG. 4C is a schematic top plan view of one example of a conductivelayer for a package substrate of the antenna switch module of FIGS.4A-4B.

FIG. 5A is a schematic top plan view of an antenna switch moduleaccording to another embodiment.

FIG. 5B is a schematic top plan view of one example of a conductivelayer for a package substrate of the antenna switch module of FIG. 5A.

FIG. 6 is a schematic top plan view of an antenna switch moduleaccording to another embodiment.

FIG. 7A is a cross section of an antenna switch module according toanother embodiment.

FIG. 7B is a schematic top plan view of one example of a conductivelayer for a package substrate of the antenna switch module of FIG. 7A.

FIGS. 8A-8C are cross sections of various examples of via structures forantenna switch modules.

FIG. 9 is a circuit diagram illustrating one example of a filter.

DETAILED DESCRIPTION OF EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Antenna switch modules and methods of making the same are disclosedherein. In certain implementations, an antenna switch module is providedfor selecting a particular RF transmit or receive path. The antennaswitch module includes a package substrate, an integrated filter, and asilicon on insulator (SOI) die attached to the package substrate. TheSOI die includes a capacitor configured to operate in the integratedfilter and a multi-throw switch for selecting amongst the RF signalpaths. In some implementations, a surface mount inductor is attached tothe package substrate adjacent the SOI die and is configured to operatein the integrated filter with the capacitor. In certain implementations,the inductor is formed from a conductive layer of the package substratedisposed beneath a layer of the package substrate used to attach the SOIdie. By providing the antenna switch module with an integrated filterthat includes the capacitor of the SOI die, the area of the antennaswitch module can be reduced relative to a scheme in which the capacitoris formed in other ways, such as using surface mount components.Additionally, the antenna switch modules described herein can have lowinsertion loss and/or high isolation. In some implementations, theantenna switch module includes a plurality of integrated filters and theSOI die includes a plurality of capacitors configured to operate in theintegrated filters.

Overview of Examples of Wireless Devices that can Include Antenna SwitchModules

FIG. 1 is a schematic block diagram of one example of a wireless ormobile device 11 that can include one or more antenna switch modules.The wireless device 11 can include antenna switch modules implementingone or more features of the present disclosure.

The example wireless device 11 depicted in FIG. 1 can represent amulti-band and/or multi-mode device such as a multi-band/multi-modemobile phone. By way of examples, Global System for Mobile (GSM)communication standard is a mode of digital cellular communication thatis utilized in many parts of the world. GSM mode mobile phones canoperate at one or more of four frequency bands: 850 MHz (approximately824-849 MHz for Tx, 869-894 MHz for Rx), 900 MHz (approximately 880-915MHz for Tx, 925-960 MHz for Rx), 1800 MHz (approximately 1710-1785 MHzfor Tx, 1805-1880 MHz for Rx), and 1900 MHz (approximately 1850-1910 MHzfor Tx, 1930-1990 MHz for Rx). Variations and/or regional/nationalimplementations of the GSM bands are also utilized in different parts ofthe world.

Code division multiple access (CDMA) is another standard that can beimplemented in mobile phone devices. In certain implementations, CDMAdevices can operate in one or more of 800 MHz, 900 MHz, 1800 MHz and1900 MHz bands, while certain W-CDMA and Long Term Evolution (LTE)devices can operate over, for example, about 22 radio frequency spectrumbands.

Antenna switch modules of the present disclosure can be used within amobile device implementing the foregoing example modes and/or bands, andin other communication standards. For example, 3G, 4G, LTE, and AdvancedLTE are non-limiting examples of such standards.

In certain embodiments, the wireless device 11 can include an antennaswitch module 12, a transceiver 13, an antenna 14, power amplifiers 17,a control component 18, a computer readable medium 19, a processor 20,and a battery 21.

The transceiver 13 can generate RF signals for transmission via theantenna 14. Furthermore, the transceiver 13 can receive incoming RFsignals from the antenna 14. It will be understood that variousfunctionalities associated with transmitting and receiving of RF signalscan be achieved by one or more components that are collectivelyrepresented in FIG. 1 as the transceiver 13. For example, a singlecomponent can be configured to provide both transmitting and receivingfunctionalities. In another example, transmitting and receivingfunctionalities can be provided by separate components.

In FIG. 1, one or more output signals from the transceiver 13 aredepicted as being provided to the antenna 14 via one or moretransmission paths 15. In the example shown, different transmissionpaths 15 can represent output paths associated with different bandsand/or different power outputs. For instance, the two different pathsshown can represent paths associated with different power outputs (e.g.,low power output and high power output), and/or paths associated withdifferent bands. The transmit paths 15 can include one or more poweramplifiers 17 to aid in boosting a RF signal having a relatively lowpower to a higher power suitable for transmission. Although FIG. 1illustrates a configuration using two transmission paths 15, thewireless device 11 can be adapted to include more or fewer transmissionpaths 15.

In FIG. 1, one or more detected signals from the antenna 14 are depictedas being provided to the transceiver 13 via one or more receiving paths16. In the example shown, different receiving paths 16 can representpaths associated with different bands. For example, the four examplepaths 16 shown can represent quad-band capability that some wirelessdevices are provided with. Although FIG. 1 illustrates a configurationusing four receiving paths 16, the wireless device 11 can be adapted toinclude more or fewer receiving paths 16.

To facilitate switching between receive and/or transmit paths, theantenna switch module 12 can be included and can be used electricallyconnect the antenna 14 to a selected transmit or receive path. Thus, theantenna switch module 12 can provide a number of switchingfunctionalities associated with an operation of the wireless device 11.The antenna switch module 12 can include a multi-throw switch configuredto provide functionalities associated with, for example, switchingbetween different bands, switching between different power modes,switching between transmission and receiving modes, or some combinationthereof. The antenna switch module 12 can also be configured to provideadditional functionality, including filtering and/or duplexing ofsignals.

FIG. 1 illustrates that in certain embodiments, the control component 18can be provided for controlling various control functionalitiesassociated with operations of the antenna switch module 12 and/or otheroperating component(s). For example, the control component 18 can aid inproviding control signals to the antenna switch module 12 so as toselect a particular transmit or receive path. Non-limiting examples ofthe control component 18 are described herein in greater detail.

In certain embodiments, the processor 20 can be configured to facilitateimplementation of various processes on the wireless device 11. Theprocessor 20 can be a general purpose computer, special purposecomputer, or other programmable data processing apparatus. In certainimplementations, the wireless device 11 can include a computer-readablememory 19, which can include computer program instructions that may beprovided to and executed by the processor 20.

The battery 21 can be any suitable battery for use in the wirelessdevice 11, including, for example, a lithium-ion battery.

FIG. 2 is a schematic block diagram of another example of a wirelessdevice 30 that can include one or more antenna switch modules. Theillustrated wireless device 30 includes first to fifth antennas 14 a-14e, a power amplifier module 31, a front-end module 32, a diversityfront-end module 34, first to fifth antenna switch modules 40 a-40 e, amultimode transceiver 44, a Wi-Fi/Bluetooth module 46, and a FM/MobileTV module 48.

The multimode transceiver 44 is electrically coupled to the poweramplifier module 31, to the front-end module 32, and to the diversityfront-end module 34. The multimode transceiver 44 can be used togenerate and process RF signals using a variety of communicationstandards, including, for example, Global System for MobileCommunications (GSM), Code Division Multiple Access (CDMA), widebandCDMA (W-CDMA), Enhanced Data Rates for GSM Evolution (EDGE), and/orother proprietary and non-proprietary communications standards.

The power amplifier module 31 can include one or more power amplifiers,which be used to boost the power of RF signals having a relatively lowpower. Thereafter, the boosted RF signals can be used to drive the firstantenna 14 a. The power amplifier module 31 can include power amplifiersassociated with different power outputs (e.g., low power output and highpower output) and/or amplifications associated with different bands.

The front-end module 32 can include circuitry that can aid the multimodetransceiver 44 in transmitting and receiving RF signals. For example,the front-end module 32 can include one or more low noise amplifiers(LNAs) for amplifying signals received using the first antenna 14 a. Thefront-end module 32 can additionally and/or alternatively include filtercircuitry, input and output matching circuitry and/or power detectioncircuitry. In certain implementations, the front-end module 32 can alsoinclude one or more power amplifiers.

The first antenna switch module 40 a is electrically coupled to thefirst antenna 14 a, to the power amplifier module 31, and to thefront-end module 32. The first antenna switch module 40 a can be used toelectrically connect the first antenna 14 a to a desired transmit orreceive path. In certain embodiments described herein, the antennaswitch module 40 a can have a relatively small area, thereby improvingthe form factor of a mobile device used to communicate over a cellularor other network. The antenna switch module 40 a can also have a lowinsertion loss and high band-to-band isolation, which can improve thequality of signals transmitted or received. For example, the antennaswitch module can improve the quality of voice or data transmissionsmade using the first antenna 14 a and/or improve reception quality for agiven amount of power consumption.

In certain implementations, the diversity front-end module 34, thesecond antenna switch module 40 b, and the second or diversity antenna14 b can also be included. Using a diversity front-end module 34 and thesecond antenna 14 b can help improve the quality and/or reliability of awireless link by reducing line-of-sight losses and/or mitigating theimpacts of phase shifts, time delays and/or distortions associated withsignal interference of the first antenna 14 a. In some implementations,a plurality of diversity front-end modules, diversity antennas, andantenna switch modules can be provided to further improve diversity.

As illustrated in FIG. 2, the second antenna switch module 40 b has beenused to select amongst a multitude of RF signal paths associated withthe diversity antenna 14 b. In certain embodiments described herein, thesecond antenna switch module 14 b can have a small area and a relativelylow insertion loss and noise. Accordingly, the second antenna switchmodule 14 b can help improve signal quality in the diversity signal pathfor a given power level, thereby reducing the probability of a calldrop-out or a lost connection. Furthermore, by providing an antennaswitch module with a smaller area, the form factor of the wirelessdevice 30 can be reduced.

The wireless device 30 includes the Wi-Fi/Bluetooth module 46, which canbe used to generate and process received Wi-Fi and/or Bluetooth signals.For example, the Wi-Fi/Bluetooth module 46 can be used to connect to aBluetooth device, such as a wireless headset, and/or to communicate overthe Internet using a wireless access point or hotspot. To aid inselecting a desired Wi-Fi or Bluetooth signal path, the third antennaswitch module 14 c has been included. In certain embodiments describedherein, the antenna switch module 40 c can have a relatively small area,thereby improving the form factor of a mobile device used to communicateover the Internet and/or with a Bluetooth accessory. The antenna switchmodule 40 c can also have a low insertion loss and a high isolation,which can impact the quality of voice transmissions made or receivedusing a Bluetooth device and/or improve the quality of a Wi-Fi Internetconnection. For example, the antenna switch module 40 c can improveconnection strength and/or access range of the wireless device 30 to awireless access point for a given amount of power consumption.

The FM/Mobile TV module 48 can be included in the wireless device 30,and can be used to receive and/or transmit radio or television signals,such as FM signals and/or VHF signals. The FM/Mobile TV module 48 cancommunicate with the fourth and fifth antennas 14 d, 14 e using thefourth and fifth antenna switch modules 40 d, 40 e, respectively. Incertain embodiments described herein, the antenna switch modules 40 d,40 e can have a relatively small area, thereby improving the form factorof a mobile device having mobile TV or FM radio capabilities.Additionally, the antenna switch modules 40 d, 40 e can also have a lowinsertion loss and high isolation, which can lead to improved streamingof multimedia content for a given amount of power consumption.

Although antenna switch modules have been illustrated and describedabove in the context of two examples of wireless devices, the antennaswitch modules described herein can be used in other wireless devicesand electronics.

Overview of Antenna Switch Modules

FIG. 3 is a schematic block diagram of one example of an antenna switchmodule 50. The antenna switch module 50 includes a high band filter 51,a low band filter 52, a switch 54, and switch control logic 56.

The high band filter 51 is electrically connected to a first signal portTX1 of the antenna switch module 50 and to the switch 54. The low bandfilter 52 is electrically connected to a second signal port TX2 of theantenna switch module 50 and to the switch 54. The switch 54 is alsoelectrically connected to an antenna port ANT of the antenna switchmodule 50 and to a third signal port TRX1, a fourth signal port TRX2, afifth signal port TRX3, a sixth signal port TRX4, a seventh signal portRX1, an eighth signal port RX2, a ninth signal port RX3, and a tenthsignal port RX4 of the antenna switch module 50. Although the antennaswitch module 50 is illustrated as including ten signal ports and oneantenna port, in certain implementations the antenna switch module caninclude more or fewer signal ports and/or additional antenna ports.

The switch 54 can be used to electrically connect a particular RF signalpath to an antenna. For example, an antenna can be electrically coupledto the antenna port ANT, and RF signal paths or components can beelectrically connected to the signal ports of the antenna switch module50. The switch control logic 56 can be configured to control the switch54 such that a signal port associated with a selected RF signal path iselectrically connected to the antenna port ANT. In certainimplementations, the switch 54 is a multi-throw switch. However, theswitch 54 can be implemented in any suitable manner, and in someimplementations can include a plurality of switch components configuredto collective operate as a multi-throw switch. Although not illustrated,the switch control logic 56 can include inputs and/or outputs to aid theswitch control logic 56 in communicating with other circuitry,including, for example, circuitry external to the antenna switch module50.

As described earlier, electrically coupling multiple RF signal paths toan antenna using the antenna switch module 50 can help an electronicdevice communicate over a variety of networks, use different powermodes, and/or communicate using different communication standards. Forexample, the illustrated configuration can be used to support quad-bandGSM/EDGE and/or multi-band configurations of W-CDMA or LTE. However,persons having ordinary skill in the art will appreciate that the switchcontrol module 50 can be configured in other ways.

One or more of the terminals or ports of the antenna switch module 50can be electrically coupled to a filter to aid in filtering unwantedharmonics and/or noise from an RF signal. For example, the first andsecond signal ports TX1, TX2 have been electrically coupled to the highband and low band filters 51, 52, respectively. In certainimplementations, the high band filter 51 is a low-pass filter configuredto filter a GSM or CDMA signal in the 1800 MHz and/or 1900 MHz bands andthe low band filter 52 is a low-pass filter configured to filter a GSMor CDMA signal in the 800 MHz and/or 900 MHz bands. However, the highband and low band filters 51, 52 can be implemented in other ways, andcan be configured to, for example, filter signals of different standardsand/or frequencies. Additionally, although only two of the signal portsof the antenna switch module 50 are illustrated as including filters,more or fewer signal ports of the antenna switch module 50 can includefilters.

FIG. 4A is a schematic top plan view of an antenna switch module 60according to one embodiment. The antenna switch module 60 includes apackage substrate 62, a silicon on insulator (SOI) die 70, and bondwires 78.

The package substrate 62 includes a die attach paddle or pad 64 and bondpads 66. The SOI die 70 has been attached or mounted to the die attachpad 64 of the package substrate 62. Although not illustrated in FIG. 4A,the package substrate 62 can include a plurality of conductive andnon-conductive layers laminated together, and the die attach pad 64 andthe bond pads 66 can be formed from a conductive layer disposed on thesurface of the package substrate used to attach the SOI die 70.

The SOI die 70 includes an SOI switch 72, a first SOI capacitor 74 a, asecond SOI capacitor 74 b, and pads 76. The SOI switch 72 can be, forexample, a single pole multi-throw switch, such as a SP9T switch. Incertain implementations, the SOI switch 72 can include a plurality ofswitches or switch elements configured to collective operate as amulti-throw switch.

As illustrated in FIG. 4A, bond wires 78 can be used for electricallyconnecting the pads 76 of the SOI die 70 to bond pads 66 disposed on thepackage substrate 62. The bond wires 78 can provide power, ground,and/or signal connections between the SOI die 70 and the packagesubstrate 62. Although the antenna switch module 60 is illustrated asusing bond wires 78 to establish electrical connections between the SOIdie 70 and the package substrate 62, the SOI die 70 can be electricallyconnected in other ways. For example, as will be described in detailbelow with reference to FIGS. 7A-7B, the SOI die 70 can be used in aflip-chip configuration. Accordingly, the bond wires 78 need not beincluded in some implementations.

The first and second SOI capacitors 74 a, 74 b can be capacitors formedon the SOI die 70, such as metal-insulator-metal (MIM) capacitors and/ormetal-oxide-metal (MOM) capacitors. In one embodiment, the first andsecond SOI capacitors 74 a, 74 b each have a capacitance selected to bein the range of about 0.8 pF to about 2.7 pF. For example, the SOIcapacitors can have a capacitance of about 0.8 pF for DCS/PCS high bandand about 2.65 pF for GSM/EDGE low band. The first and second SOIcapacitors 74 a, 74 b can occupy any suitable amount of die area, suchas between about 29,925 square um to about 33,972 square um of die area,for example, about 32,000 square um of die area.

As will be described in detail below with reference to FIGS. 4B-4C, theantenna switch module 60 includes integrated filters formed from thefirst and second SOI capacitors 74 a, 74 b and from inductors (notillustrated in FIG. 4A) disposed in the package substrate 62. Byincluding integrated filters in the antenna switch module 60, RF signalquality can be improved by reducing or removing harmonic signalcomponents from RF signals traveling through the antenna switch module60. Additionally, forming integrated filters from capacitors disposed onan SOI die 70 and from inductors disposed in the package substrate 62can reduce the form factor of the antenna switch module 60 by usingthree-dimensional (3D) integrated filter structures. For example, theillustrated antenna switch module 60 can have a reduced size relative toa scheme in which spiral inductors and surface mount capacitors aredisposed side by side on a surface of the package substrate adjacent aswitch die.

FIG. 4B is a cross section of the antenna switch module 60 of FIG. 4Ataken along the lines 4B-4B. The antenna switch module 60 includes thepackage substrate 62, the SOI die 70, and the bond wires 78. Theillustrated package substrate 62 is a multi-layer substrate includingfirst to sixth conductive layers 81-86 and first to fifth non-conductivelayers 91-95. FIG. 4C is a schematic top plan view of one example of thethird conductive layer 83 of the package substrate 62 of FIGS. 4A-4B.The third conductive layer 83 includes a first spiral inductor 101, asecond spiral inductor 102 and first to eleventh vias 104 a-104 k.

The package substrate 62 can include one or more inductors that can beused with SOI capacitors to form integrated filters of the antennaswitch module 60. For example, the third conductive layer 83 includesthe first and second spiral inductors 101, 102, which can beelectrically connected to the first and second capacitors 74 a, 74 b(see FIG. 4A) of the SOI die 70 to form a high band and a low bandfilter, respectively. Accordingly, in certain implementations describedherein, an antenna switch module is provided with at least oneintegrated filter that includes a capacitor disposed on an SOI die andan inductor formed from a conductive layer of a package substrate.

As shown in FIG. 4B, the conductive layers 81-86 can be configured toalternate with the non-conductive layers 91-95. For example, the firstnon-conductive layer 91 is disposed between the first and secondconductive layers 81, 82, the second non-conductive layer 92 is disposedbetween the second and third conductive layers 82, 83, the thirdnon-conductive layer 93 is disposed between the third and fourthconductive layers 83, 84, the fourth non-conductive layer 94 is disposedbetween the fourth and fifth conductive layers 84, 85, and the fifthnon-conductive layer 95 is disposed between the fifth and sixthconductive layers 85, 86. Although the illustrated package substrate 62includes six conductive layers and five non-conductive layers, more orfewer conductive and/or non-conductive layers can be provided.Additionally, although the package substrate 62 is shown as includingconductive layers on the major surfaces of the package substrate 62,non-conductive layers can be included instead on one or more of themajor surfaces of the package substrate 62.

The first to sixth conductive layers 81-86 can each be been patterned toform traces. For example, the first conductive layer 81 has beenpatterned to form the bond pads 66 and the die attach pad 64, which hasbeen used to attach the SOI die 70. Additionally, the third conductivelayer 83 has been patterned to form the first and second spiralinductors 101, 102, which can be formed from trace of the thirdconductive layer 83. Although the first and second spiral inductors 101,102 are illustrated as being formed from the third conductive layer 83of the package substrate 62, the first and second spiral inductors 101,102 can be formed from any suitable layer of the package substrate 62,including, for example, any conductive layer of the package substratedisposed beneath the layer used to attach the SOI die 70. In someimplementations, the first and second spiral inductors 101, 102 can beformed from trace of more than one conductive layer of the packagesubstrate 62. For example, in one embodiment, the first and secondinductors 101, 102 are each formed from spiral inductor structuresdisposed on the third and fourth conductive layers 83, 84.

Vias can be formed between conductive layers to allow electricalconnections to be made within the package substrate 62. For example,openings or holes can be provided in any of the non-conductive layers91-95 of the package substrate 62 and the holes can be filled with aconductor to form vias in the package substrate 62 for electricallyconnecting adjacent conductive layers. Accordingly, an electricalcircuit can be formed by selecting the pattern of the conductive layers81-86 and by selecting the location of the vias. The package substrate62 can be any suitable multi-layer substrate, such as amulti-chip-module (MCM) substrate including alternating conductive andnonconductive layers. In one implementation, the conductive layerscomprise copper and the nonconductive layers comprise a prepregmaterial. Although a particular configuration of vias is illustrated inFIG. 4C, more or fewer vias can be included. For example, additionalvias associated with ground or power connections can be provided.

The first and second spiral inductors 101, 102 can be electricallyconnected to the first and second capacitors 74 a, 74 b (see FIG. 4A) ofthe SOI die 70 to form integrated filters. For example, the first andsecond spiral inductors 101, 102 can be electrically connected to thefirst and second capacitors 74 a, 74 b, respectively, by using viastructures in the package substrate 62 and by using the bond wires 78.In one implementation, the first inductor 101 has an inductance in therange of about 6 nH to about 7 nH, for example, about 6.5 nH, and thesecond inductor 102 has an inductance in the range of about 2.5 nH toabout 3 nH, for example, about 2.8 nH. Persons having ordinary skill inthe art will appreciate that the first and second spiral inductors 101,102 illustrate one of many examples of spiral inductor structuressuitable for use with the antenna switch module 60.

To aid in electrically isolating the first and second inductors 101, 102from each other, a column of vias can be provided between the first andsecond inductors 101, 102. For example, as shown in FIG. 4C, the firstto seventh vias 104 a-104 g have been provided between the first andsecond inductors 101, 102 to help prevent magnetic and/or electricfields of the inductors from interfering with one another. In certainimplementations, vias can be placed between each conductive layer suchthat each of the vias in the column extends from a first major surfaceof the package substrate to a second major surface of the packagesubstrate. Although seven vias are illustrated as being used toelectrically isolate the first and second inductors 101, 102, more orfewer vias can be used. For example, between about 6 vias and about 9vias can be disposed in a column between the first and second inductors101, 102. However, more or fewer vias can be used in certainconfigurations. In one implementation, adjacent vias in the column ofvias are separated by a distance of less than about 230 um. Variousexamples of vias structures suitable for use in electrically isolatingthe first and second inductors 101, 102 will be described in furtherdetail below with reference to FIGS. 8A-8C.

Although the antenna switch module 60 of FIGS. 4A-4C is illustrated anddescribed as including two integrated filters, the antenna switch module60 can be configured to include more or fewer integrated filters.

FIG. 5A is a schematic top plan view of an antenna switch module 110according to another embodiment. The antenna switch module 110 includesthe package substrate 62, the SOI die 70, the bond wires 78, and asurface mount inductor 102. The package substrate 62 includes the dieattach pad 64 and the bond pads 66, and the SOI die 70 includes the SOIswitch 72, the first capacitor 74 a, the second capacitor 74 b, and thepads 76. The SOI die 70 has been mounted or attached to the die attachpad 64, and the bond wires 78 have been used to attach the pads 76 ofthe SOI die 70 to the bond pads 66. The surface mount inductor 102 ismounted or attached to the package substrate 62 adjacent the SOI die 70.The surface mount inductor 102 is electrically connected to the secondcapacitor 74 b of the SOI die 70.

As was described earlier with respect to FIG. 4B, the package substrate62 can be a multi-layer substrate including a plurality of conductiveand non-conductive layers. FIG. 5B is a schematic top plan view of oneexample of a conductive layer 120 for the package substrate 62 of FIG.5A. The conductive layer 120 includes a spiral inductor 121 and firstand second vias 124 a, 124 b, which can aid in electrically connectingthe spiral inductor 121 to the first capacitor 74 a of the SOI die 70.

The antenna switch module 110 of FIG. 5A is similar to the antennaswitch module 60 of FIGS. 4A-4B, except that the antenna switch module110 includes integrated filters configured in a different arrangement.For example, the antenna switch module 110 includes a first integratedfilter formed using the first SOI capacitor 74 a and the spiral inductor121 of the package substrate 62. Additionally, the antenna switch module110 further includes a second integrated filter formed using the secondSOI capacitor 74 b and the surface mount inductor 102. In oneembodiment, the first integrated filter is a high band filter and thesecond integrated filter is a low band filter.

In certain implementations described herein, an antenna switch modulecan include integrated filters formed from SOI capacitors and surfacemount inductors and/or formed from SOI capacitors and spiral inductorsof a package substrate. Using both surface mount inductors and spiralinductors formed from package substrate trace can aid in improvingisolation between filters. Additionally, using both surface mountinductors and spiral inductors in integrated filter structures canincrease routing resources in the package substrate, thereby allowingtraces and vias to be used for other purposes, such as increasing arobustness of a ground supply provided to the SOI die through thepackage substrate.

FIG. 6 is a schematic top plan view of an antenna switch module 140according to another embodiment. The antenna switch module 140 includesthe package substrate 62, an SOI die 150, the bond wires 78, and firstand second surface mount inductors 102 a, 102 b. The package substrate62 includes the die attach pad 64 and the bond pads 66, and the SOI die150 includes the SOI switch 72, the first capacitor 74 a, the secondcapacitor 74 b, and the pads 76. The SOI die 150 has been mounted orattached to the die attach pad 64, and the bond wires 78 have been usedto attach the pads 76 of the SOI die 150 to the bond pads 66. The firstand second surface mount inductors 102 a, 102 b are mounted or attachedto the package substrate 62 adjacent the SOI die 150, and the first andsecond surface mount inductors 102 a, 102 b are electrically connectedto the first and second capacitors 74 a, 74 b, respectively.

The antenna switch module 140 of FIG. 6 is similar to the antenna switchmodule 60 of FIGS. 4A-4C, except that the antenna switch module 140includes integrated filters configured in a different arrangement. Forexample, the antenna switch module 140 includes a first integratedfilter formed using the first SOI capacitor 74 a and the first surfacemount inductor 102 a and a second integrated filter formed using thesecond SOI capacitor 74 b and the second surface mount inductor 102 b.In certain implementations described herein, an antenna switch modulecan include integrated filters formed from SOI capacitors and surfacemount inductors. Additional details of the antenna switch module 140 canbe similar to those of the antenna switch module 60 described earlier.

FIG. 7A is a cross section of an antenna switch module 160 according toanother embodiment. The antenna switch module 160 includes a packagesubstrate 164, a SOI die 170 and solder bumps or balls 162. The packagesubstrate 164 includes first to sixth conductive layers 171-176 andfirst to fifth non-conductive layers 181-185. FIG. 7B is a schematic topplan view of one example of the fourth conductive layer 174 of thepackage substrate 164 of the antenna switch module 160 of FIG. 7A. Thefourth conductive layer 174 includes a first spiral inductor 191, asecond spiral inductor 192 and first to eleventh vias 194 a-194 k. Thefirst to seventh vias 194 a-194 g have been provided as a column of viasbetween the first and second spiral inductors 191, 192 in a mannersimilar to that described earlier with respect to FIG. 4C.

The antenna switch module 160 of FIG. 7A is similar to the antennaswitch module 60 of FIGS. 4A-4B, except that the antenna switch module160 is implemented using a flip-chip configuration. For example, ratherthan using wire bonds to electrically connect the SOI die 170 to thepackage substrate 164, the SOI die 170 of FIG. 7A has been flippedupside down and attached to the package substrate 164 using solder bumps162. The SOI die 170 can include first and second SOI capacitors, whichcan be electrically connected to the first and second spiral inductors191, 192, respectively, to form first and second integrated filters ofthe antenna switch module 160. Accordingly, in certain implementationsdescribed herein, antenna switch modules are provided using an SOI diein a flip-chip arrangement.

Persons having ordinary skill in the art will appreciate that the firstand second spiral inductors 191, 192 illustrate one of many examples ofspiral inductor structures suitable for use with the antenna switchmodule 160. Additionally, the first and/or second spiral inductors 191,192 can be formed on any suitable conductive layer or layers of thepackage substrate 164, and thus need not be formed from the fourthconductive layer 174. Furthermore, in certain configurations, theantenna switch module 160 can be modified such that the spiral inductors191, 192 are omitted in favor of using surface mount inductors or suchthat a mix of spiral inductors and surface mount inductors are used toform integrated filters. Additional details of the antenna switch module160 can be similar to those described earlier with respect to theantenna switch modules of FIGS. 4A-6.

FIGS. 8A-8C are cross sections of various examples of via structures forantenna switch modules.

FIG. 8A is a cross section of one example of a portion of a packagesubstrate 200 for an antenna switch module. The package substrate 200includes a via structure 203 formed through a non-conductive region orstructure 204 of the package substrate 200. The via structure 203electrically connects a first conductive layer 201 to a secondconductive layer 202, which are disposed on opposing major surfaces ofthe package substrate 200. Accordingly, the via structure 203 is athrough-substrate via. The via structure 203 can be used in the columnof vias 104 a-104 g of FIG. 4C and/or in the column of vias 194 a-194 gof FIG. 7B.

FIG. 8B is a cross section of another example of a portion of a packagesubstrate 210 for an antenna switch module. The package substrate 210includes first to sixth conductive layers 211-216, a non-conductiveregion or structure 228 and first to fifth vias 221-225. The first tofifth vias 221-225 are aligned with one another and electrically connectthe first conductive layer 211 to the sixth conductive layer 216, whichare disposed on opposing major surfaces of the package substrate 210. Insome implementations, one or more of the vias in the column of vias 104a-104 g of FIG. 4C and/or in the column of vias 194 a-194 g of FIG. 7Bcan have a structure similar to that illustrated in FIG. 8B.

FIG. 8C is a cross section of another example of a portion of a packagesubstrate 230 for an antenna switch module. The package substrate 230includes first to sixth conductive layers 211-216, a non-conductiveregion 228 and first to fifth vias 221-225. The package substrate 230 issimilar to the package substrate 210 of FIG. 8B, except that the firstto fifth vias 221-225 are staggered rather than aligned. In someimplementations, one or more of the vias in the column of vias 104 a-104g of FIG. 4C and/or in the column of vias 194 a-194 g of FIG. 7B canhave a structure similar to that illustrated in FIG. 8C.

FIG. 9 is a circuit diagram illustrating one example of a filter 240.The filter 240 includes an inductor 241 and a capacitor 242. Theinductor 241 includes a first end electrically connected to a node N₁and a second end electrically connected to a first end of the capacitor242 at a node N₃. The capacitor 242 further includes a second endelectrically connected to a node N₂.

In some implementations described herein, antenna switch modules caninclude an integrated filter electrically connected in the configurationshown in FIG. 9. For example, the filter 240 can be configured tooperate as a low pass filter, and the node N₁ can be configured toreceive a RF signal, the node N₂ can be electrically connected toground, and the node N₃ can be configured to generate an output of thefilter 240. In certain implementations, an SOI capacitor operate as thecapacitor 242 and a surface mount inductor and/or a spiral inductorformed from trace in a package substrate can operate as the inductor241. Although the filter 240 illustrates one possible implementation ofthe integrated filters described herein, other configurations arepossible.

Applications

Some of the embodiments described above have provided examples inconnection with mobile phones. However, the principles and advantages ofthe embodiments can be used for any other systems or apparatus that haveneeds for antenna switch modules.

Such antenna switch modules can be implemented in various electronicdevices. Examples of the electronic devices can include, but are notlimited to, consumer electronic products, parts of the consumerelectronic products, electronic test equipment, etc. Examples of theelectronic devices can also include, but are not limited to, memorychips, memory modules, circuits of optical networks or othercommunication networks, and disk driver circuits. The consumerelectronic products can include, but are not limited to, a mobile phone,a telephone, a television, a computer monitor, a computer, a hand-heldcomputer, a personal digital assistant (PDA), a microwave, arefrigerator, an automobile, a stereo system, a cassette recorder orplayer, a DVD player, a CD player, a VCR, an MP3 player, a radio, acamcorder, a camera, a digital camera, a portable memory chip, a washer,a dryer, a washer/dryer, a copier, a facsimile machine, a scanner, amulti functional peripheral device, a wrist watch, a clock, etc.Further, the electronic devices can include unfinished products.

CONCLUSION

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Likewise, the word “connected”, as generally used herein, refers to twoor more elements that may be either directly connected, or connected byway of one or more intermediate elements. Additionally, the words“herein,” “above,” “below,” and words of similar import, when used inthis application, shall refer to this application as a whole and not toany particular portions of this application. Where the context permits,words in the above Detailed Description using the singular or pluralnumber may also include the plural or singular number respectively. Theword “or” in reference to a list of two or more items, that word coversall of the following interpretations of the word: any of the items inthe list, all of the items in the list, and any combination of the itemsin the list.

Moreover, conditional language used herein, such as, among others,“can,” “could,” “might,” “can,” “e.g.,” “for example,” “such as” and thelike, unless specifically stated otherwise, or otherwise understoodwithin the context as used, is generally intended to convey that certainembodiments include, while other embodiments do not include, certainfeatures, elements and/or states. Thus, such conditional language is notgenerally intended to imply that features, elements and/or states are inany way required for one or more embodiments or that one or moreembodiments necessarily include logic for deciding, with or withoutauthor input or prompting, whether these features, elements and/orstates are included or are to be performed in any particular embodiment.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While certain embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A method of making an antenna switch module, themethod comprising: providing a package substrate implemented to receiveone or more electrical components; attaching a silicon on insulator(SOI) die to the package substrate, the SOI die including a firstcapacitor and a switch coupled to a plurality of radio frequency (RF)signal paths; and providing a first integrated filter that filters an RFsignal received on a first RF signal path of the plurality of RF signalpaths, the first integrated filter including the first capacitor of theSOI die and a first inductor.
 2. The method of claim 1 wherein the firstinductor is a surface mount component, the method further comprisingattaching the first inductor to the package substrate.
 3. The method ofclaim 1 further comprising implementing the first inductor at leastpartly from a first conductive layer of a plurality of conductive layersof the package substrate, the first conductive layer disposed beneath alayer of the package substrate used to attach the SOI die.
 4. The methodof claim 3 further comprising implementing the first inductor from traceof two or more of the plurality of conductive layers.
 5. The method ofclaim 3 further comprising implementing the inductor to have aninductance ranging between about 2.5 nH and about 7 nH.
 6. The method ofclaim 1 further comprising providing a second integrated filter thatfilters an RF signal received on a second RF signal path of theplurality of RF signal paths, the second integrated filter including asecond capacitor of the SOI die and a second inductor.
 7. The method ofclaim 6 further comprising implementing the first and second inductorsat least partly from a first conductive layer of a plurality ofconductive layers of the package substrate, the first conductive layerdisposed beneath a layer of the package substrate used to attach the SOIdie.
 8. The method of claim 7 further comprising electrically isolatingthe first and second inductors using a column of vias of the packagesubstrate.
 9. The method of claim 8 further comprising implementing thecolumn of vias of the package substrate to be aligned with one another.10. The method of claim 8 further comprising implementing the column ofvias of the package substrate to be staggered with respect to oneanother.
 11. The method of claim 6 wherein the first inductor is asurface mount component, the method further comprising attaching thefirst inductor to the package substrate and implementing the secondinductor at least partly from a first conductive layer of a plurality ofconductive layers of the package substrate, the first conductive layerdisposed beneath a layer of the package substrate used to attach the SOIdie.
 12. The method of claim 6 wherein the first inductor is a firstsurface mount component and the second inductor is a second surfacemount component, the method further comprising attaching the first andsecond inductors to the package substrate.
 13. The method of claim 1wherein attaching the SOI die to the package substrate includeselectrically connecting the SOI die to the package substrate using bondwires.
 14. The method of claim 1 wherein attaching the SOI die to thepackage substrate includes electrically connecting the SOI die to thepackage substrate using solder bumps.
 15. A method of switching in anantenna switch module, the method comprising: receiving a plurality ofradio frequency (RF) signals at a multi-throw switch over a plurality ofRF signal paths, the multi-throw switch being disposed on a silicon oninsulator (SOI) die attached to a package substrate; filtering a firstRF signal of the plurality of RF signals to generate a first filteredsignal using a first integrated filter, the first integrated filterincluding a first capacitor of the SOI die and a first inductorassociated with the package substrate; and providing the filtered signalto an antenna using the multi-throw switch.
 16. The method of claim 15further comprising receiving the first RF signal from an output of apower amplifier.
 17. The method of claim 15 further comprising filteringa second RF signal of the plurality of RF signals to generate a secondfiltered signal using a second integrated filter, the second integratedfilter including a second capacitor of the SOI die and a second inductorassociated with the package substrate.
 18. The method of claim 17wherein the first inductor and the second inductor are implemented usinga plurality of conductive layers of the package substrate, the methodfurther comprising electrically isolating the first and second inductorsusing a column of vias of the package substrate.
 19. The method of claim17 wherein filtering the first RF signal includes filtering a high bandradio frequency signal in an 1800 MHz band or a 1900 MHz band.
 20. Themethod of claim 19 wherein filtering the first RF signal includesfiltering a low band radio frequency signal in an 800 MHz band or a 900MHz band.